materials.thermal_pad

materials.thermal_pad()

A filled-silicone thermal interface pad (gap filler).

Representative of a 3 W/(mK) gap pad such as Henkel Bergquist Gap Pad 3000S30. Note poisson_ratio = 0.49: elastomers are very nearly incompressible, and linear HEX8/TET4 elements lock* volumetrically that close to 0.5 — a pad modelled with this value on a coarse linear mesh will read far too stiff. Use TET10, or drop the ratio to ~0.45 deliberately, if the pad’s compliance is what you are solving for; for a purely thermal study the ratio is irrelevant. The yield figure is a nominal compressive proof stress, not a metallic yield point.

Sources: Henkel Bergquist Gap Pad 3000S30 datasheet; Parker Chomerics THERM-A-GAP product data (mechanical figures).

Returns

Name	Type	Description
	Material	A fresh Material with a soft matte pink-grey appearance.